乾式切割機 (Dry dicer)_SAM-CT1520D/2533D

NT$99,999

總價 : NT$99,999

台灣獨家代理

Dicing cut by high speed and precise motion of X/Y axes

Features

  • The cutting speed is between 1 to 200mm/sec, the minimum cutting pitch is 0.2 to 0.5mm, and cutting line is corrected by reading fiducial marks.
  • Grinding by blade affects little stress on components on PCB
  • Blade type can be changed according to target board
  • The machine can detect wear or tear of the blade, and also ionize the target board
  • Water doesn’t need to be supplied or disposed because it is not required
  • UV tape is not required because the target board is fixed in place by fixture jig
  • Various cutting modes can be selected by keyboard
  • Error message is indicated on the display

商品規格

ModelSAM-CT1520DSAM-CT2533D
Board thicknessCutting range150×200mm250×330mm
Board thicknesst=0.4-2.0mm
MaterialFR4, CEM1, CEM3, etc
Component height limitUpper face: 4mm (including PCB thickness)
Bladeφ75×φ40×t=0.2-0.5mm
X axisActive range370mm520mm
Maximum motion speed・Scale resolution・Repeatability500mm/sec・0.001mm・±0.01mm
Y axisActive range350mm500mm
Maximum motion speed・Table motion speed・Scale resolution・Repeatability500mm/sec・1~200mm/sec・0.001mm・±0.01mm
Z axisActive range27mm
Motion speed・Scale resolution・Repeatability1~50mm/sec・0.001mm・±0.01mm
θ axisMax. rotation angle100° (-5°~+95°)
Repeatability±3″
R axisOutput90W
Max. RPM13,000rpm
Machine bodyPower supplyφ3 AC200V 50/60Hz
Maximum electric consumptionapprox. 3.0kVA (including standard dust collector [VNA-15])approx. 5.0kVA (including standard dust collector [PiF-30])
Air pressure0.5-0.7MPa
Air consumptionapprox. 300L/min
Outer sizeW800×D1,210×H1,300mm (excluding monitor and signal tower [Option])W950×D1,570×H1,335mm (excluding monitor and signal tower [Option])
Weightapprox. 700kgapprox. 800kg
Dust Collector (Output)0.75kw1.35kw
Static eliminatorAC – high frequency fan type

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