Thermal conductivity is the core selection parameter for a thermal pad.
This pad has a thermal conductivity of 16.8 W/m·K.
Technical specifications
| Item | Specification |
|---|---|
| Thermal conductivity | 16.8 W/m·K |
| Size (standard) | 85 × 45 × 2 mm |
| Thickness options | 0.5 mm – 3 mm (quoted on request) |
| Material | High-elasticity silicone, high compression ratio, fits closely to chip surfaces |
| Temperature resistance | Heat resistant, does not volatilize in long-term use |
| Electrical conductivity | Non-conductive, safe for electronic components |
| Custom sizes | Available, please contact us |
Where to use it
- Laptop cooling upgrades
- Graphics card VRAM cooling
- SSD cooling
- CPU / VRM modules
- Industrial server boards
- LED heat-sink substrates
Cut to the size of the target component, apply it and press the heatsink straight on — no curing time needed, suited to quick maintenance or frequent replacement. Use with copper plates or aluminum heatsinks for good thermal performance.
Request a quote
Standard size 85 × 45 × 2 mm, 16.8 W/m·K; for other thicknesses and custom sizes, please ask. Request a quote →