This series of consumables for DISCO dicing saws includes ZH05 series blades and the PB08-F40 dresser board, for precision dicing and wafer processing equipment.
Dicing blade specifications
| P/N | Type | Blade thickness | Material | Cutting depth | Feed speed | Spindle speed |
|---|---|---|---|---|---|---|
| ZH05-SD3500-N1-50 BA | Hard blade | 50 μm | Si / Si + oxide layer | 400 μm | 10–60 mm/s | 30,000 rpm |
| ZH05-SD4000-N1-50 BC | Hard blade | 50 μm | Si / Si compounds | 400 μm | 20–60 mm/s | 30,000 rpm |
| ZH05-SD4500-N1-50 | Hard blade | 50 μm | Hard brittle materials | 400–680 μm | 30–90 mm/s | 35,000 rpm |
Dresser board specifications
| P/N | Type | Specification | Function |
|---|---|---|---|
| PB08-F40-A0001 | F40 dresser board | Φ54 mm, grit F40 | Blade dressing and shaping |
Features
- Precision cutting for precision materials
- For blade dressing and maintenance (dresser board)
- Keeps blade cutting quality consistent
- Extends blade life
Applications
- Semiconductor wafer dicing
- LED substrate processing
- Precision ceramic and glass cutting
- Electronic component manufacturing
For equipment maintenance spares and production needs, please ask for a volume quote.
Trademarks: DISCO and the model names on this page are trademarks or model names of their owners, used here only to identify the products. JIAHON is not the authorized distributor of this brand in Taiwan.
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