Removes silicon debris from the wafer surface and dicing streets after sawing.
Overview
After dicing, silicon debris and other residue stay on the wafer surface and in the streets; if not removed, they cause problems in later packaging. JHPBT-490 uses two-fluid cleaning (programmable in stages), CDA air-knife water removal and spin drying, designed to avoid cracking, residual water and adhesive strings, without water marks.
Cassette loading for 8″ and 12″ wafers on steel ring frames; a robot arm picks and places the frames, and the cleaning cycle runs automatically without operator intervention.
Process flow: cassette loading → robot frame handling → two-fluid cleaning (staged) → CDA air knife → spin drying.
Applications
- Wafers: removing silicon debris and dicing residue from surface and streets
- Precision cleaning in COB packaging
- Precision cleaning of camera modules
Specifications
| Item | Value |
|---|---|
| Model | JHPBT-490 |
| Size | 1500 (L) × 1000 (W) × 1864 (H) mm |
| Weight | 800 kg |
| Product size | Standard 8″ and 12″ wafers |
| Carrier | Standard stainless ring frame |
| Loading | Standard 8″ / 12″ cassettes |
| Particle size removed | ≥ 0.5 µm |
| Cleaning yield | 96% or higher |
| Exhaust | Φ100 mm |
| N₂ / CDA inlet | Φ8 mm each |
| Water inlet / drain | Φ12 mm / Φ32 mm |
| CDA pressure | 0.5–0.7 MPa |
| Power | AC 380 V / 50 Hz (60 Hz available), 3.5 kW |
Power frequency follows the unit’s nameplate; please confirm the configuration when ordering.
Features
- Automatic loading and unloading: cassette loading, robot frame handling.
- Top FFU and air filtration: U15 filter (99.995% at 0.1–0.2 µm); compressed air also filtered.
- Static elimination: ionizing air system.
- High-speed spin drying: no water marks.
- All-SUS304 body: durable, resistant to acidic and alkaline cleaning fluids.
Which one to choose
- Post-dicing wafers, inline with auto loading: JHPBT-490.
- Swing-arm rotary two-fluid cleaning, 4″–12″ wafers: wafer cleaner JHPBT-650.
- Centrifugal cleaning of camera modules and wafers: JHPBT-550.
- Surface activation / organic removal before cleaning: JHPBT-590.
Request a quote
Tell us wafer size, frame type, throughput and dicing process. Request a quote →