Nitrogen-purged baking and preheating for oxidation-sensitive electronic components.
Unlike a general-purpose oven, the JHSXH-480 has a nitrogen flow meter and a quick-connect nitrogen inlet, so the nitrogen flow can be controlled during baking. Nitrogen displaces moisture and oxygen in the chamber, which helps protect oxidation-sensitive parts such as MLCCs, semiconductors, LEDs and electrolytic capacitors at high temperature.
Features
| Feature | Description |
|---|---|
| Nitrogen circuit | Distributes the inert gas to every corner of the chamber, instead of the circulating air duct of a standard oven |
| Nitrogen flow meter | Controls the nitrogen flow so that less nitrogen is used |
| Quick-connect inlet | Easy connection, cylinder change and flow adjustment |
| Programmable control | Multi-step heating and cooling profiles for component baking and preheating |
| Sizes | JHSXH-480 is the standard model; other chamber sizes can be made to order |
Typical uses
| Industry | Typical parts / use |
|---|---|
| Electronic components | Baking and preheating MLCCs, quartz oscillators and precision ceramic parts |
| Semiconductor / optoelectronics | Moisture removal and pre-baking of semiconductor devices and LCM / LCD / LED / TFT modules |
| Passive components | Electrolytic capacitors, silicone rubber and plastic keypads that need a low-oxygen bake |
| Automotive / communications | Baking and temperature testing of automotive electronics and communication modules |
| Pharmaceutical / chemical | Drying and pre-treatment of oxidation-sensitive materials |
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