JIAHON is not the authorized distributor of Wickon, KIC or DATAPAQ in Taiwan.
How to choose a reflow profiler: Wickon, KIC and DATAPAQ specifications
For reflow and wave soldering temperature profiling, three brands are commonly seen: Wickon, KIC and DATAPAQ. Their accuracy is the same; they differ in resolution, memory, sampling rate, start modes and power-loss protection, and whether those differences matter depends entirely on your measuring situation. This page lists each manufacturer’s stated specifications side by side and explains when each specification really matters.
Note: we supply both Wickon and KIC. This page lists manufacturer-stated specifications and does not rate the brands; choose by your plant’s measuring needs, and ask each manufacturer for its current datasheet if needed.
1. Specifications side by side
| Item | Wickon | KIC | DATAPAQ |
|---|---|---|---|
| Memory | 4,000,000 points | 224,640 points | 216,000 points |
| Accuracy | ±0.5 °C | ±0.5 °C | ±0.5 °C |
| Resolution | 0.01 °C | 0.1 °C | 0.1 °C |
| Measuring range | −200 to 1370 °C | −150 to 1050 °C | −200 to 1250 °C |
| Sampling rate (higher setting) | 20 per second | 10 per second | 10 per second |
| Operating voltage | DC 3.7–4 V | DC 6.7–9 V | DC 3.6–4 V |
| Battery | Rechargeable lithium, 850 mAh | 9 V battery / AA batteries | Rechargeable NiMH, 600 mAh |
| Consumption (manufacturer stated) | ≤ 5 mAh | ≤ 90 mAh | ≤ 30 mAh |
| Max. internal operating temperature | 105 °C | 110 °C | 85 °C |
| Logger size (10-channel) | 178 × 45 × 20 mm | 260 × 115.3 × 20 mm | 221 × 60 × 20 mm |
| Thermal barrier size | 220 × 75 × 35 mm | 245 × 85 × 36 mm | 330 × 95 × 36 mm |
| Start mode | Air start / switch start / timed start, selectable | Air start | Switch start |
| Continuous test storage | Up to 24 runs stored, read by group afterwards | Single run | Single run |
| Power-loss protection | FLASH memory, data kept on power loss | None | None |
| PWI process capability analysis | In software | In software | None |
Unit note: the manufacturers’ comparison lists “consumption” in mAh. mAh is a battery capacity unit, not a power or current unit. If you want to estimate battery life from it, first confirm with each manufacturer whether the figure means average operating current (mA) or charge used per measurement.
2. Which specifications actually matter to you
All three are ±0.5 °C accurate, so “how accurate” is not the deciding factor. The real differences are below; judge them against your plant’s actual situation.
- Resolution 0.01 °C vs 0.1 °C: for peak temperature or time above liquidus (TAL), 0.1 °C is fully sufficient. 0.01 °C only matters for products with very narrow process windows or for observing fine changes in ramp rate.
- Memory: capacity sets how long and how many runs can be recorded. A single run on one oven rarely needs 4 million points; what uses capacity is continuous profiling of several lines or long, high-rate sampling.
- Sampling rate 20 vs 10 per second: reflow ramp rates are usually a fraction of a degree per second, and 10 samples per second fully reproduces the profile. Higher rates help at the moment of wave contact or when capturing very short thermal shocks.
- Max. internal operating temperature: this sets how long the thermal barrier can hold out. The higher the oven temperature and the slower the conveyor, the greater the heat load inside. Check this first if your oven has a high peak or is very long.
- Power-loss protection: if you often run long or multiple consecutive profiles, losing power midway and starting over is costly. Models with FLASH protection make a clear difference here; for single runs it matters little.
- Start mode: air start suits pushing the unit straight into the oven where a switch is inconvenient; switch start suits manual control of the start point; timed start suits scheduled automatic starts. This is purely a matter of line practice.
- Logger and thermal barrier size: size decides whether it fits through. Measure belt or chain clearance height, oven entrance height and the gap between fixture and board before deciding. This is often overlooked and easily causes a hold-up on the spot.
- PWI process capability analysis: PWI (Process Window Index) converts the results into a single number showing how much margin remains to the process window limits. If you track process capability trends or provide evidence for customer audits, built-in PWI saves a lot of manual calculation.
3. Should wave soldering be considered too?
Reflow and wave soldering measuring conditions differ: wave soldering contacts molten solder, so the thermal barrier’s sealing and heat resistance requirements are stricter and the measuring range must be higher. If you run both processes and want to share one system, include the wave soldering conditions when selecting, rather than calculating from reflow conditions only.
4. What to check beyond the datasheet
- Thermocouple wire and results: the same instrument with different wire types or gauges gives different profiles. Confirm wire specifications and attachment method together with the instrument.
- Calibration and traceability: customer audits usually require traceable calibration records for measuring equipment. Confirm before purchase whether the manufacturer or distributor offers calibration service and intervals.
- Software licensing and compatibility: confirm the license type (single or multiple PCs), supported operating system versions, and whether export formats work with your existing SPC or MES system.
- Consumables and spares: thermal barrier insulation, thermocouple wire and batteries are consumables. Long-term cost of ownership often lies not in the unit itself but in the availability and replacement cycle of these spares.
After measuring: five numbers and how they relate to PWI
Once the profile is recorded, look at five numbers: ramp rate, soak, time above liquidus (TAL), peak temperature and cooling rate, each compared with the solder paste manufacturer’s datasheet and component specifications. For reading methods and tables, see section 7 “How to read a reflow profile” in the article on attaching thermocouples for oven profiling.
If the software has PWI, it converts these items into where the profile sits within the process window. PWI is calculated from the measured profile, so if thermocouple attachment is inconsistent, PWI will be off too: standardize attachment first, then look at PWI.
FAQ
All three are ±0.5 °C accurate; does resolution still matter? Accuracy is how close the reading is to the true value; resolution is the smallest difference the instrument can distinguish. With equal ±0.5 °C accuracy, 0.01 °C resolution does not make results more accurate but shows fine profile changes more clearly. For most reflow processes 0.1 °C is enough; higher resolution is needed only for very narrow process windows or ramp rate studies.
What is PWI, and can I work without it? PWI is the Process Window Index: it compares the measured profile with the window limits and gives a percentage, below 100% being within the window and smaller meaning more margin. Without built-in PWI you can calculate it in a spreadsheet, but manually each time; for long-term trend management or customer audit evidence, built-in PWI saves a lot of work.
Which item is most often got wrong when selecting? Size. Everyone reads the numbers in the table, but what actually gets stuck is whether the thermal barrier plus fixture still fits through. Measure the oven entrance and belt clearance height before ordering, including fixture thickness.
What is the difference between an 85 °C and a 105 °C internal limit? How long the thermal barrier can hold out. The logger itself must not exceed this temperature, and the barrier keeps the heat out during the pass through the oven. The higher the peak temperature, the longer the oven and the slower the conveyor, the greater the heat load. For high-temperature long ovens, confirm first that it can last the whole pass.
Which brands do you supply? Both Wickon and KIC, including loggers, thermal barriers and thermocouple wire. If you already have a unit and only need thermocouple wire or thermal barrier consumables, you can ask for those separately.
Standards referenced
Please refer to the current versions published by each organization.
- IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies — Global Electronics Association (formerly IPC)
- IPC-A-610, Acceptability of Electronic Assemblies
We supply the items mentioned on this page.
Related: Wickon SMT reflow profilers · KIC reflow profilers · Wickon Q24 profiler specification · Wickon Q12 profiler specification · Wickon thermal barrier temperature ratings
From: JIAHON Engineering
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