25 × 250 mm, blade thickness 1.5–5 mm, handle thickness 15 mm.
Solder paste has to be stirred thoroughly before the jar is used, so that the flux and the solder powder mix evenly and the paste returns to its best viscosity. If it is stirred too little, the viscosity is low or the paste is unevenly distributed, and after printing it tends to slump, give too little solder, or print out of position. The geometry of the spatula directly affects how well it stirs: the thin blade end (1.5 mm) fits against the bottom of the jar to scrape, and the thick handle end (15 mm) gives a stable grip. The overall size of 25 × 250 mm fits the handling of standard 500 g and 1 kg solder paste jars.
Specifications
| Item | Specification |
|---|---|
| Overall size | 25 × 250 mm |
| Blade thickness | Thinnest 1.5 mm / thickest 5 mm |
| Handle thickness | 15 mm |
| Use | Stirring SMT solder paste |
Reminder: before stirring, confirm that the paste has reached room temperature (normally 2–4 hours standing, depending on the process). Stir for the time recommended by the paste manufacturer; stirring too long also affects paste quality.