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Shin-Etsu X-23-7783D thermal compound, 1 kg

Shin-Etsu Chemical X-23-7783D is a silicone-grease thermal compound with high thermal conductivity. It is used as a thermal interface material between a heat-generating part and its heat sink. This page is for the 1 kg jar, a size for batch application or regular maintenance.

Specifications

ItemDescription
Manufacturer / modelShin-Etsu Chemical / X-23-7783D
TypeSilicone thermal grease
Pack1 kg jar
Thermal conductivityHigh; ask us for the data sheet (TDS) for the exact value
Operating temperature−50 °C to +120 °C (manufacturer’s catalogue)
Electrical propertyNot an insulating material. The catalogue gives a breakdown strength below the lower limit of measurement, so it is not for places that need insulation
Used betweenCPU, GPU or MPU and the heat sink
Shelf life12 months

Where it is used

The thermal interface between a CPU, GPU or MPU and the heat sink.

Before you order

We suggest you get the manufacturer’s data sheet (TDS) before buying, to confirm the thermal conductivity and the suggested application thickness. When you inquire, tell us the application and the expected monthly use.

Request a quote

Availability and price are confirmed in our reply. Request a quote →

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