For stacking and shipping IC substrates and package carriers without oxidation.
When IC substrates and package carriers are stacked or shipped, three things go wrong: sulfur contamination (leads turn black from sulfidation), static attracting fine dust, and boards scratching each other. Ordinary kraft or interleaving paper contains sulfur that speeds up oxidation of copper surfaces, especially at high temperature. This paper is made from sulfur-free fiber with an antistatic coating and a clean, low-lint surface, addressing all three.
Specifications
| Item | Specification |
|---|---|
| Material | Sulfur-free fiber + antistatic coating |
| Sulfur | Sulfur-free formulation, no sulfides |
| Static | Antistatic coating suppresses static build-up and dust attraction |
| Cleanliness | No shedding, no powder; for Class 100–1000 environments |
| Physical | Stiff and tear resistant; stacks stay flat |
| Size | Cut to your line’s needs |
Key features
- Sulfur-free: no sulfide content, avoiding sulfide corrosion where the paper touches copper surfaces or silver pads.
- Antistatic coating: suppresses static and reduces fine particles settling on substrate surfaces.
- Cleanroom grade: no shedding or powder, for Class 100–1000 environments, including automated packing.
- No transfer, no scratching: a clean surface that leaves no chemical transfer or scratches on substrates.
- Fully custom sizes: cut to the size of your parts, for manual or automated packing.
Where it is used
IC packaging and wafer plants, PCB and SMT plants, package test lines, precision parts logistics, cleanrooms and labs, and separating optical and ceramic parts.
Request a quote
Tell us the part size, the cut size you need and the quantity. Request a quote →