Removes dust and particles without damaging the wafer surface.
Overview
Wafers and precision optoelectronic parts must be cleaned thoroughly without any surface damage. JHPBT-650 holds the wafer on a vacuum chuck (4″–12″), cleans with a swing-arm rotary two-fluid spray for full coverage, and spin-dries at 50–2800 rpm (adjustable). All process parameters are programmable, and an automatic door with safety light curtain protects the operator. For semiconductor packaging, optical lens manufacturing, CMOS modules and similar processes.
Specifications
| Item | Value |
|---|---|
| Machine size | 770 (L) × 820 (W) × 1630 (H) mm |
| Wafer size | 4″–12″ vacuum chucks (optional) |
| Cleaning mechanism | Vacuum chuck + swing arm rotation + two-fluid cleaning |
| Spin speed | 50–2800 rpm, adjustable |
| Safety | Automatic door with safety light curtain, real-time monitoring |
Advantages
- Vacuum chuck: holds the wafer securely without clamping damage.
- Swing-arm cleaning, no blind spots: settable cleaning range, no re-contamination.
- Programmable control: time, sequence and parameters set to your process.
Which one to choose
- Single wafers 4″–12″, swing-arm two-fluid: JHPBT-650.
- Post-dicing wafers on ring frames with cassette auto loading: inline wafer cleaner JHPBT-490.
Request a quote
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